One of the biggest changes that came to both the iPhone 15 Pro and 15 Pro Max is the switch from the stainless steel frame to a lighter, yet stronger titanium frame. However, once customers got their hands on those smartphones, they noticed that the devices tended to overheat. Combined with the breakthrough A17 Pro chip, which is based on the first-generation 3nm process, this issue became widespread online which could sway customers into buying the latest flagship phones from Apple. Eventually, this issue was remedied with a later iOS 17 update. Back in last November, there was a rumor that claimed that this year’s lineup of iPhones would feature an improved thermal management system.
With that in mind, Apple is looking to tweak the internal designs for its upcoming iPhone 16 models to further manage heat better. According to The Information, the next-generation iPhones will adopt a “larger graphic sheet” inside the enclosure to optimally dissipate heat. This wouldn’t be the first time that Apple tweaked the internal design for optimal thermal management. When Apple introduced the iPad Pro (M4) back in May, the company announced that its flagship tablet adopted a copper-made Apple logo, which acted as a heat sink to allow the M4 chip to perform more sustainably with less overheating.
We expect Apple to announce its iPhone 16 lineup at its annual Apple event around September.
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